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Summary

Title:
Area array packaging processes : for BGA, Flip Chip, and CSP
Author:
Gilleo, Ken
Formats:
   
Editions:
5
Total Holdings:
99
OCLC Work Id:
837365826
Record Link:
http://classify.oclc.org/classify2/ClassifyDemo?owi=837365826
DDC: Class Number Holdings Links
Most Frequent 621.381046 98 Web Dewey
Edition: 22 621.381046 96  
LCC: Class Number Holdings Links
Most Frequent TK7874 97 ClassWeb

VIAF Authority Links

Name VIAF ID
Gilleo, Ken 63188125
 

Editions

Displaying 1 to 5 of 5
Displaying 1 to 5 of 5
.